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Custom Application
ECD
Power(W):19.5
Maximum output voltage(KV):3
Improves efficiency and throughput: three times that of ordinary power supplies;
Reducing back-side gas errors, increasing throughput and eliminating wafer sticking/bursting problems;
Control of parameters such as overcurrent, presence of wafer and wafer clamping thresholds, clamping voltage, offset voltage and internal or external amplitude/offset control;
Versatility in amplitude/offset and output control during tuning;
Control of outputs using rear panel I/O, serial computer commands, or front panel controls;
Configuration of custom clamp and de-clamp sequences and waveforms.
Lockable front panel control interface.
Support for Coulombic and Johnsen-Rahbek ESC technologies.
Upload and store electrostatic chuck profiles to the device and store them internally through a user-friendly software interface.
Wafer detection including no wafer, present wafer or wafer clamping status.
Product introduction
Wisman's ECD series of software-driven electrostatic chuck power supplies offer a range of features to meet a wide variety of demanding applications. The instrument incorporates Wisman amplifier technology, which has been shown to increase efficiency and throughput by as much as three times that of other power supplies. Reduce backside gas errors, increase throughput and eliminate wafer sticking/popping issues; control parameters such as overcurrent, wafer presence and wafer clamp thresholds, clamp voltage, offset voltage, and internal or external amplitude/offset control; versatility in amplitude/offset and output control during adjustment; control output using rear panel I/O, serial computer commands, or front panel controls; configure custom clamping and declamping sequences and waveforms. The versatile and trusted performance of Wisman's ECD allows for use in a wide range of unique tools and processes without adding new costs for each unique tool or process in the facility.
Features:
Lockable front panel control interface.
Each unit is supplied with a traceable calibration certificate.
Supports Coulombic and Johnsen-Rahbek ESC technologies.
Electrostatic chuck profiles are uploaded and stored to the device and stored internally through a user-friendly software interface.
Wafer detection including no wafers, wafers present or wafer clamping status.
Application Areas:
Electrostatically driven material handling.
Semiconductor wafer processing.
Non-mechanical transfer of flat sheets or other processed materials sensitive to mechanical handling.
Characteristic description:
Input: DC24V, 2A
Output.
Output phase
Output voltage A (reference phase): 0 to ±3 kV
Output voltage B (phase B = [-1] x phase A): 0 to ±3 kV
Output voltage range: 0 to ±3 kV DC, max.
Output current: 0 to ±6.5 mA DC with 10 mA peak capability
Voltage display:
Proportional: 1V/ 300 V
B-phase DC: accuracy better than 0.5% of full scale
Misalignment voltage: less than 10 mV
Output noise:less than 50 mV rms
Current display:
Scale: 1 V/1 uA
DC Accuracy: ±0.1 microAmps
Output noise: less than 50 mV rms*
Operating conditions:
Temperature: 0 to 35°C (32 to 104°F)
Relative humidity: to 85%, non-condensing
Altitude: to 2000 m (6561.68 ft)
Dimensions: H x W x D 88.1 x 431.8 x 531.9 mm (3.47 x 17 x 20.9 in.), 2U enclosure
Weight: 5.0 kg (11 lbs)
DC input jack: 2.0 mm locking DC jack; center is positive and housing is negative (jack with Switchcraft S761K plug)
Grounded receptacle with grounding bolt.